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Memory Module Specification

Document No. 4803852-001.B00

01/28/04

KHX3200/1G

1GB 128M x 64-Bit PC3200

CL2.5 184-Pin DIMM

KEYED

Page 1

DESCRIPTION:

This document describes Kingston's 128M x 64-bit 1GB (1024MB) DDR400 CL2.5 SDRAM (Syn-

chronous DRAM) memory module.The components on this module include sixteen 64M x 8-bit (16M

x 8-bit x 4 Bank / 200MHz, 5ns) DDR400 SDRAM in TSOP packages. This 184-pin DIMM uses gold

contact fingers and requires +2.6V. The electrical and mechanical specifications are as follows:

FEATURES:

Power supply : Vdd: 2.6V ± 0.1V, Vddq: 2.6V ± 0.1V

Double-data-rate architecture; two data transfers per clock cycle

Bidirectional data strobe(DQS)

Differential clock inputs(CK and CK)

DLL aligns DQ and DQS transition with CK transition

Programmable Read latency 2.5, 3 (clock)

Programmable Burst length (2, 4, 8)

Programmable Burst type (sequential & interleave)

Timing Reference: 2.5-3-3-7-1 at +2.6V

Edge aligned data output, center aligned data input

Auto & Self refresh, 7.8us refresh interval(8K/64ms refresh)

Serial presence detect with EEPROM

High Performance Heat Spreader

PCB : Height 1.250” (34.75mm), double sided component

PERFORMANCE:

Clock Cycle Time (tCK) 5ns (min.) / 10ns (max.)

Row Cycle Time (tRC) 55ns (min.)

Refresh Row Cycle Time (tRFC) 70ns (min.)

Row Active Time (tRAS) 40ns (min.) / 70,000ns (max.)

Power (IDD0) 5.408 W (operating per module)

UL Rating 94 V - 0

Operating Temperature 0

C to 70

Storage Temperature -55

C to +150

1 2

Inhaltsverzeichnis

Seite 1 - Memory Module Specification

Memory Module SpecificationDocument No. 4803852-001.B0001/28/04KHX3200/1G1GB 128M x 64-Bit PC3200CL2.5 184-Pin DIMMKEYEDPage 1DESCRIPTION:This documen

Seite 2 - MODULE DIMENSIONS:

Kingston TechnologyDocument No. 4803852-001.B00 Page 2MODULE DIMENSIONS:0.0500.0078 ±0.006(0.20 ±0.15)(1.270)0.100(2.50 )0.250(6.350)0.157(4.00)0.071(

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